TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 1 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? applications sot-363 package ? wireless infrastructure ? catv / satv / moca ? point to point ? defense & aerospace ? test & measurement equipment ? general purpose wireless product features functional block diagram ? dc-6000 mhz ? flat, broadband frequency response ? 20.3 db gain @ 1.9 ghz ? 3.9 db noise figure @ 1.9 ghz ? +28.5 dbm output ip3 @ 1.9 ghz ? +15.5 dbm p1db @ 1.9 ghz ? 50 ohm cascadable gain block ? single supply, 45 ma current ? sot-363 package general description pin configuration the TQP369184 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface- mount package. at 1.9 ghz, the amplifier typically provides 20.3 db gain, +28.5 dbm oip3, and 3.9 db noise figure while drawing 45 ma current. the device combines dependable performance with consistent quality to maintain mttf values exceeding 100 years at mounting temperatures of +85c. the device is housed in a lead-free/green/rohs-compliant industry-standard sot-363 package. the tqp369181 consists of a darlington-pair amplifier using the high reliability ingap/gaas hbt process technology. only dc-blocking capacitors, a bias resistor, and an inductive rf choke are required for operation. this broadband mmic amplifier can be directly applied to various current and next generation wireless technologies such as cdma, w-cdma, and lte. in addition, the TQP369184 will work for other applications within the dc to 6 ghz frequency range. pin # symbol 3 rf in 6 rf out 1, 2, 4, 5 gnd ordering information part no. description TQP369184 ingap/gaas hbt gain block TQP369184-pcb 0.5-4 ghz evaluation board standard t/r size = 3000 pieces on a 7? reel
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 2 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -55 to 150 o c rf input power,cw,50 ? ,t=25oc +24 dbm device voltage, v device 4.5 v operation of this device outsi de the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units tcase -40 +85 o c tj (for>10 6 hours mttf ) +160 o c electrical specifi cations are measured at sp ecified test conditions. specifications are not guarantee d over all recommended operating conditions. electrical specifications t est conditions unless otherwise noted: i cc = 45 ma, t case = +25oc, 50 ? system. parameter conditions min typical max units operational frequency range dc 6000 mhz test frequency 1900 mhz gain 18.8 20.3 21.8 db input return loss -15 db output return loss -24 db output p1db +15.5 dbm output ip3 see note 1. +25.5 +28.5 dbm noise figure 3.9 db device voltage, v device 3.9 4.5 v device current, i device 45 ma thermal resistance (jnc to case) jc 226 o c/w n otes: 1. oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. th e suppression on the largest im3 prod uct is used to calculate the oip3 using 2:1 rule. 2:1 rule gives relative value with re spect to fundamental tone.
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 3 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? device characterization data s-parameter data v device = 3.9 v (typ.), i cc = 45 ma (typ.), t case = +25 c freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 10 -32.5 -177.9 22.6 179.6 -24.1 0.9 -35.7 85.5 20 -31.3 178.1 22.6 179.2 -24.0 0.4 -41.7 59.7 50 -30.7 168.6 22.6 178.0 -24.2 0.0 -58.8 111.5 100 -29.9 152.6 22.6 176.2 -24.1 -0.4 -54.6 -176.0 200 -27.9 131.8 22.5 172.5 -24.2 0.7 -60.3 133.2 500 -23.9 102.6 22.3 162.2 -24.2 1.7 -41.7 104.5 900 -20.3 77.3 21.9 149.2 -24.2 2.6 -45.1 135.2 1000 -19.9 73.3 21.8 145.9 -24.1 3.4 -52.6 109.9 1500 -17.2 47.4 21.1 131.1 -24.2 4.1 -39.7 -28.7 1900 -15.7 26.3 20.5 120.0 -24.2 5.1 -26.2 -35.1 2000 -15.1 21.0 20.3 117.4 -24.2 5.5 -24.6 -39.5 2500 -12.4 -5.3 19.4 105.2 -24.4 6.5 -18.2 -46.9 3000 -10.0 -17.9 18.5 94.3 -24.7 7.3 -14.6 -43.4 3500 -9.0 -24.3 17.6 85.2 -24.9 8.7 -12.9 -40.9 4000 -8.5 -27.4 16.9 77.1 -24.9 12.1 -12.9 -36.9 4500 -9.1 -27.6 16.5 69.6 -25.0 14.4 -14.7 -31.4 5000 -10.8 -26.9 16.2 61.0 -24.9 17.4 -20.0 -16.1 5500 -14.5 -28.1 16.1 51.2 -24.8 20.0 -25.7 73.4 6000 -22.4 -51.2 15.9 39.3 -24.9 20.7 -17.1 126.2 notes: 1. measured on TQP369184-pcb using external off-board, wi de-band bias tee and dc blocks (50 ohm system). 2. solt ecal at network analyzer test cable ends. 3. input and output reference planes extended to the device leads.
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 4 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? application circuit configuration bill of material: TQP369184-pcb component values for specific frequencies use the component values in this table for optimal operation at specific frequencies . reference designator frequency (mhz) 50 500 900 1900 2200 2500 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c2, c3 .018 uf 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf bias resistor values for va rious supply voltages select r1 to satisfy 45 ma operating current at the available supply voltage. v supply (volts) 5 6 7 8 9 10 12 r1 value 24 ? 47 ? 68 ? 91 ? 110 ? 130 ? 180 ? size 0805 1206 1210 1210 1210 2010 2010 reference des. value description manufacturer part number q1 n/a gain block triquint TQP369184 c1 0.018 uf cap, chip, 0603, 16v, x7r, 10% various c2, c3 56 pf cap, chip, 0603, 50v, npo, 5% various l1 39 nh inductor, 0603, 5%, ceramic toko r1 24 ? res, chip, 0805, 1/10w, 5% various n otes: 1. see pc board layout, under application info rmation section, for more information. 2. all components are of 0603 size unless otherwise stated.
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 5 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? typical performance test conditions unle ss otherwise noted: v supply = 5 v, r bias = 24 ? , i device = 45 ma, t case = +25 c notes: 1. oip3 measured with two tones at an output power of 0 dbm / to ne separated by 1 mhz. the supp ression on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. measured on TQP369184-pcb. performance plots test conditions unle ss otherwise noted: v supply = 5 v, r bias = 24 ? , i cc = 45 ma, TQP369184-pcb 0 5 10 15 20 25 0 1000 2000 3000 4000 5000 6000 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c ? 40 c -40 -30 -20 -10 0 0 1000 2000 3000 4000 5000 6000 input return loss (db) frequency (mhz) input return loss vs. frequency +85 c +25 c ? 40 c -40 -30 -20 -10 0 0 1000 2000 3000 4000 5000 6000 output return loss (db) frequency (mhz) output return loss vs. frequency +85 c +25 c ? 40 c 22 24 26 28 30 32 -3-2-10123 oip3 (dbm) pout/tone (dbm) oip3 vs. pout/tone over temp freq =1900 mhz 1 mhz tone spacing +85 c +25 c ? 40 c 12 13 14 15 16 17 18 -40 -15 10 35 60 85 p1db (dbm) temperature (deg. c) p1db vs. temperature frequency mhz 500 900 1900 2100 2600 gain db 22.2 22.0 20.3 20.0 19.0 input return loss db -20 -32 -15 -13 -10 output return loss db -15 -21 -24 -18 -14 output p1db dbm +16.4 +16.2 +15.5 +15.5 +14.8 oip3 [1] dbm +30.0 +29.8 +28.5 +28.4 +27.4 noise figure db 3.8 3.8 3.9 3.9 4.0
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 6 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? pin description pin symbol description 3 rf in rf input, matched to 50 ohms. external dc block is required. 6 rf out rf output / dc supply, matched to 50 ohms. external dc block, bias choke, and dropping resistor is required. 1, 2, 4, 5 gnd multiple vias should be employed to minimize inductance and thermal resistance; see pcb mounting pattern in mechanical information section. applications information pc board layout top rf layer is .014? nelco n4000-13, ? r = 3.7 typ., 4 total layers (0.062? thick) for mechani cal rigidity. metal layers are 1-oz copper. 50 ohm microstrip line details: width = .029?, spacing = .035? the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. for further technical information, refer to www.triquint.com
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 7 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? mechanical information package information and dimensions the component is marked on the top surface of the package with a ?184? designator and on the bottom surface w ith an alphanumeric lot code. pcb mounting pattern top notes: 1. all dimensions are in millimeters (inches). angles are in degrees 2. ground / thermal vias are critical for the proper performance of this devi ce. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diam eter of .25 mm (.010?). 3. use 1 oz. copper minimum. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. rf trace width depends upon the pc board material and construction. bottom
TQP369184 dc-6 ghz gain block data sheet: rev c 12/09/11 - 8 of 8 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? product compliance information esd information esd rating: class 1c value: passes 1000 v to < 2000 v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes 1000 v test: charged device model (cdm) standard: jedec standard jesd22-c101 solderability package lead plating: annealed matte tin over copper compatible with both lead-free (260c max. reflow temp.) and tin/lead (245c max. reflow temp.) soldering processes. rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating moisture sensitivity level 1 at 260c per jedec standard ipc/jedec j-std-020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information abou t triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatso ever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and th e entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any part y any patent rights, licenses, or any other intellectual prope rty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be exp ected to cause severe pers onal injury or death.
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